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LED54SC

LED54SC - Optically Immersed 5.4 µm LED

PLEASE NOTE: All IR LED specifications are currently under review.

led package

LEDs are fabricated from III-V heterostructures grown onto InAs substrates. Optical immersion of lens with flip-chip devices enables three to five fold increase of output power.

Features

Low power consumptions (µW to mW range)

Angle of emittance <40°

Switching time: 10 ns (typical), 20 ns (max)

Narrow bandwidth: FWHM = 0.1 to 0.2 λmax

Wide operating temperature range


Specifications (@T=22 °C)

Peak wavelength, λ, µm: 5.40 ± 0.10

Spectral width, FWHM, µm: 0.60 ± 0.05

Current test conditions: Pulse duration, µs: <10

Current test conditions: Pulse period, µs: >1000

Voltage at drive current I = 1A, Upulse, V: 0.4 to 0.7

Pulsed power at I=1 A, Ppulse, µW: >25

CW power at I=100 mA (attached to a heatsink), PCW, µW: >5

Switching time, ns: 10 (typical), 20 (max)

Package code: Screw

Thread: M5x0.5

Emission size, mm: 3.2 diameter

Far-field pattern, FWHM, °: <40

Far-field pattern deviation, °: ± 10

Operation (storage) conditions, °C: -25 to +60 (+80)

Polarity: short wire or black point is negative


current charts for led19sc

Package dimensions:

led package dimensions

Ordering Information

LED54SC

 5.4 µm LED

Data Sheet

PLEASE NOTE: All IR LED specifications are currently under review.

PDF LED54SC data sheet - pdf (151K)

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